Product Introduction

IC leadframe, gold wire, and encapsulating adhesive are the three major materials for semiconductor packaging. The main functions of leadframe are to carry the chip, conduct electricity and heat, and serve as a connecting element between the IC chip and the PCB.

Product Application

IC leadframes are widely used in 3C consumer electronics, various types of home appliances, and major industries such as electronics, automobiles, aviation, and military.

Product Model