Ultimate liquid cooling solution

Product Overview

I-Chiun has expanded from its core manufacturing of chip packaging heat spreader into the broader field of system-level thermal management.
In response to emerging thermal design demands from next-generation applications such as AI servers, high-performance computing (HPC), direct liquid cooling (DLC), and immersion cooling, we provide comprehensive thermal management solutions including heat spreaders, cold plates, flow channel design, and system integration.
Our solutions are designed to balance performance, reliability, and mass-production feasibility, enabling customers to quickly adopt and optimize thermal efficiency in servers and data centers.
Leveraging our deep experience in advanced thermal technologies, I-Chiun delivers the most optimized and dependable thermal solutions to system manufacturers worldwide.

Product Category

I-Chiun’s liquid cooling technology is specifically designed for AI servers and high-performance computing (HPC) platforms, covering applications for CPUs, GPUs, memory modules, and immersion cooling systems — marking a new era of advanced thermal solutions.

Immersion Cooling

Immersion cooling is a cutting-edge thermal solution in which servers or electronic components are directly submerged in electrically insulating coolant, allowing for efficient heat dissipation while reducing energy consumption and enhancing overall system reliability.

CPU

Condenser

VC Boiler

Server liquid cooling

Cold plate

I-Chiun possesses comprehensive, end-to-end capabilities spanning from material development and microstructure and microchannel thermal design to precision manufacturing, module assembly, and reliability verification.

System Cooling

I-Chiun’s liquid cooling technology is widely applied in the thermal management of high power density components, covering key elements such as CPUs, GPUs, and memory modules.

Rack Cooling

I-Chiun features advanced manifold manufacturing capabilities, ensuring efficient fluid distribution across all channels through high precision machining and computational fluid dynamics (CFD) simulation design.
This approach guarantees uniform coolant flow, significantly enhancing the overall efficiency, stability, and reliability of rack-level liquid cooling systems.