Heat Spreader Solutions For Advanced Packaging

Product Overview

I-Chiun provides high-quality solutions with strong heterogeneous integration capabilities in response to the growing demand from global semiconductor packaging and wafer manufacturers for advanced 2.5D and 3.0D packaging technologies.

 

I-Chiun’s products have been successfully applied in various fields such as AI Data Center, GPU, CPU, CPO, robotics, 800G communication, automotive, IoT, and Network.

 

 

Through fully automated production and precise process control, I-Chiun achieves high efficiency and highly stable production capabilities, delivering fast, reliable, and consistently high-quality thermal solutions to customers worldwide.

Product Category

I-Chiun provides a variety of customized thermal solutions tailored to diverse requirements based on extensive materials engineering and process technologies. These solutions can flexibly accommodate different power densities, CTE variations, and diverse material interfaces (such as METAL TIM and Graphite Film TIM), while integrating optimized material configurations, structural designs, surface treatments, and advanced heterogeneous integration technologies.